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M02400 - SEMI M24 - 鏡面単結晶プレミアムシリコンウェーハの仕様 StdTpc-XML 本安全基準係確保在製造設備運送移動前,雖受制於個別實務情況之限制,仍儘最大可能地執行除污作業。在許多情況下,必須破壞製造設備才能完整進行化學品除污,製造設備轉讓人(transferor)必須將所有殘存之潛在風險清楚告知受讓人(transferee)。

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Description

本安全基準係確保在製造設備運送移動前,雖受制於個別實務情況之限制,仍儘最大可能地執行除污作業。在許多情況下,必須破壞製造設備才能完整進行化學品除污,製造設備轉讓人(transferor)必須將所有殘存之潛在風險清楚告知受讓人(transferee)。

This Specification covers two groups of substrate requirements for monocrystalline high-purity gallium arsenide wafers used in semiconductor and electronic device manufacture

·    一般規定

org September 2002

SEMI G28 — Specification for Leadframes for Plastic Molded S

M02400 - SEMI M24 - 鏡面単結晶プレミアムシリコンウェーハの仕様 StdTpc-XML 本安全基準係確保在製造設備運送移動前,雖受制於個別實務情況之限制,仍儘最大可能地執行除污作業。在許多情況下,必須破壞製造設備才能完整進行化學品除污,製造設備轉讓人(transferor)必須將所有殘存之潛在風險清楚告知受讓人(transferee)。global Silicon Wafer Committee20061121global Audits and Reviews Subcommittee20072www. semi. org20073CD ROM1994200511 150300 mm Referenced SEMI Standards SEMI M1 Specifications for Polished Mono crystalline Silicon Wafers SEMI M18 Guide for Developing Specification Forms for Order Entry of Silicon Wafers SEMI M45 Provisional Specification for 300 mm Wafer Shipping System SEMI M59 Terminology for Silicon Technology

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